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| SMEE’s SSA600/10 Stepper product is used for thick photo-resist packaging of 200mm and 300mm wafer in the Back-end semiconductor manufacturing process, such as multi bumps (i.e. Golden bump、Solder bump), Pillar Bump, WLCSP, RDL, etc. Exposure capability with g, h and I line of high-intensity Hg lamp delivers high throughput; Focus system has wide range and accuracy, compatible to both thin/thick photo-resist process; MVS eliminates the need for alignment targets on the wafer to enhance equipment’s adaptability to Back-end process. Its superior resolution, overlay and throughput ensure customer a product with high performance, high reliability and low CoO (Cost of Ownership). |
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