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 AWP 300 Wafer Packer |
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| AWP 300 Wafer Packer is an automatic appliance for 300mm wafer Packaging and Unpackaging, featuring: |
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Full Inventory Sensing of Substrates and Packing Materia |
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Full Sorting Capability Material Tracking(RFID,PIO, etc) |
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Dedicated Foam/Interleaf Handling for Packing &Unpacking |
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SECS/GEM Interface |
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Intelligent Material ID/Sense via Multi Sensing Dedicated Processor |
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Use Friendly Touch Screen GUI |
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Class 100 Operation within a Class 10K Environment |
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AWP 200 Wafer Packer |
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| AWP200 is an automatic appliance for Packaging and Unpackaging for 200mm wafer, featuring: |
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Lowest cost of ownership |
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Windows™ operating system |
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SECS/GEM/HSMS compliant |
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OCR/BCR read capability optional |
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Reduces breakage rates |
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Custom configuration |
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Class 1 compatible |
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Bi directional operation(pack/unpack) |
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AWP 2300 Bridge tool |
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| AWP 2300 Bridge tool is an automatic appliance for Packaging and Unpackaging, which integrates 200mm and 300mm wafer, featuring: |
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SECS/GEM/HSMS compliant |
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Class 1 compatible |
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Compliant to SEMI S2, S8 and CE standards |
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